A recent leak has shed some light on upcoming AMD motherboards and CPUs. Besides confirming the rumours that AMD would skip the 700-series naming for its next-generation motherboards, it also showed the initial line-up of Ryzen 9000 series processors.

The Gigabyte presentation shared by @wxnod shows that the Gigabyte X870 Aorus Master AM5 motherboards will support the current Ryzen 7000 (Raphael) and 8000 (Hawk Point) CPUs. However, the presentation focuses more on the upcoming Ryzen 9000 (Granite Ridge) series, which is shown to include four SKUs: the Ryzen 5 9600X, the Ryzen 7 9700X, the Ryzen 9 9900X, and the Ryzen 9 9950X.

According to Gigabyte's presentations, the Granite Ridge CPUs will default to DDR5-5600 memory support, supporting up to 8000 MT/s memory through EXPO overclocking profiles. Additionally, the Infinity Fabric clock speed has been doubled from 2000 to 2400 MHz.

As for motherboards, Gigabyte is gearing up to launch a range of motherboards for the Granite Ridge series, including an AI TOP series for the AM5 socket and at least four new chipsets. The X670E and X670 chipsets will be replaced by the X870E and X870, respectively. Both X870 chipsets support PCIe Gen5 x16 and at least one PCIe Gen5 SSD. Other features expected include an optimised WiFi antenna, USB4 capability, and DisplayPort 2.1, which is reported to be UHBR20 compliant. The only noticeable difference between the two X870 chipsets seems to be that they use two Promontory 21 chips on the X870E, while the X870 only uses one.

Moving on to the mid-range chipsets, the B650E and B650 chipsets are set to be replaced by the B850 and B840, respectively. This marks the introduction of the X40 class to AMD's portfolio, utilising a different chipset (Prom19) than the higher-tier boards. One big difference between the B850 and B840 is that the B840 does not support CPU overclocking, although both will support memory overclocking. The B840 will also lack PCIe Gen5 compatibility. Lastly, the A620 and A620A chipsets are expected to remain unchanged and will continue to be offered as an entry-level option.

The list of motherboards mentioned in the presentation can be found below:

• X870E Aorus Xtreme AI Top
• X870E Aorus Pro Ice
• X870 Aorus Elite WIFI
• X870I Aorus Pro
• B850 AI Top
• B850M DS3H
• B850M Aorus Elite AX
• B840 D2H

AMD is expected to unveil the Ryzen 9000 series at Computex next week. Gigabyte and other motherboard manufacturers will likely showcase their new motherboards at the event.

KitGuru says: If you were to build a new system with a Ryzen 9000 processor, which of the 800-series motherboards would you choose?

Nvidia NVLink technology has been a game-changer in enabling high-speed communication between GPUs and CPUs since its debut in 2014. Surpassing traditional connection standards that have become inadequate for today's high-performance accelerators, it started off being used in gaming GPUs. That's not the case anymore, as Nvidia has removed the technology from mainstream and workstation products, limiting its usage to data centres and HPC.

Efficient communication is crucial in data centres housing large clusters of accelerators. Servers require effective networking and intercommunication mechanisms, particularly when multiple GPUs are used on the same server. The most recent iteration, NVLink 5.0, comes out with Blackwell and Grace CPUs and represents a significant advancement, doubling the bandwidth over 4.0 from 100 Gbit/s to 200 Gbit/s.

With NVLink being used exclusively by Nvidia products, the rest of the industry had to develop an alternative. AMD, Intel, Google, Microsoft, Meta, and others have created a new open-source communication standard called UALink that could rival NVLink for scaling up AI applications in data centres.

According to the press release, the first standard (1.0) aims to facilitate communication between up to 1024 accelerators in a single computing pod and the connected memory, which includes GPUs. However, details regarding the maximum bandwidth are currently unavailable. The UALink Consortium is scheduled to be established in Q3 2024, and the 1.0 specifications will be available in the same quarter.

KitGuru says: Could UALink come to mainstream and workstation products?

AMD's upcoming Ryzen 9000 series, featuring Zen 5 cores, is set to debut at Computex. Leaked information from a press event has unveiled four models belonging to the upcoming series, as well as two Ryzen 5000XT CPUs.

As per the image shared by CodeCommando, the top-tier offering, the Ryzen 9 9950X, is expected to pack 16 cores and 32 threads, with a maximum clock speed of 5.7GHz, this flagship SKU will have a TDP of 170W and a substantial 80MB of cache. Meanwhile, the Ryzen 9 9900X will sport 12 cores and 24 threads, with a boost clock of 5.6GHz, a TDP of 120W, and 76MB of cache.

Image credit: CodeCommando

Moving down the line-up, the Ryzen 7 9700X will offer 8 cores and 16 threads, capable of reaching clock speeds of up to 5.5GHz, all within a 65W TDP and 40MB of cache. Similarly, the Ryzen 5 9600X, a 6-core variant with 12 threads, is expected to hit clock speeds of 5.4GHz while having the same 65W TDP.

Moreover, the leaker also shared another image showing two Ryzen 5000XT CPUs: the 8C/16T Ryzen 7 5800XT (36MB cache) and the 16C/32T Ryzen 9 5900XT (72MB cache). The image also shows that both CPUs will clock up to 4.8GHz and feature a 105W TDP.

KitGuru says: Are the Ryzen 9000 series specs in line with what you expected?

Lian Li is trying to invent a new PC case layout. This time, it's with the SUP01, which, similar to the Thermaltake CTE cases, moves the GPU to the front to act as an intake.

The SUP01 is a 45-litre case with a small footprint that doesn't sacrifice high-end hardware compatibility. Placing the GPU upright at the front of the case allows for better airflow and improved GPU performance. The adjustable bracket further enables precise vertical and horizontal positioning of the GPU. Additionally, the SUP01 comes with LED strips along the front and left sides of the casing, as well as an extra strip on the PCIe riser bracket, providing users with customisable lighting options.

Divided into three independent airflow chambers for effective heat dissipation, the SUP01 has a unique internal layout designed to offer improved cooling. The GPU serves as an intake, while three pre-installed 120mm PWM fans exhaust below the motherboard tray, forming the first airflow chamber. Furthermore, an AIO (supports up to a 280/360mm AIO) with a radiator and fans positioned beneath the motherboard tray creates a second airflow chamber for the CPU. The chassis also supports additional cooling with the option to install a 120mm fan at the back to cool motherboard components such as RAM, CPU power supply, and M.2 storage, creating the third airflow chamber.

Regarding compatibility, the SUP01's motherboard mounting tray can accommodate ATX back-connect motherboards and standard ATX, M-ATX, and Mini-ITX motherboards. The case comes with a PCIe 4.0 riser cable pre-installed on a bracket, allowing for GPUs up to four slots thick and up to 400 mm in length at the front. Storage options include space for up to two 3.5/2.5″drives in the PSU chamber and two 2.5″ SSDs installed above the PSU shroud in the main chamber, which features a mirror cover. The SUP-01 is now available for pre-order for $149.99 for both the black and white versions.

KitGuru says: What do you think of the Lian Li SUP01 case layout? Do you prefer this or Thermaltake's CTE design?

According to new rumours, the upcoming flagship Blackwell graphics card, the RTX 5090, is rumoured to sport a 448-bit memory bus, a deviation from the initial speculation that it would feature a 512-bit memory bus. This suggests a potential shift in the memory configuration initially anticipated for the GPU.

The Blackwell GPU, set to lead the Nvidia GeForce RTX 50 series, has been at the centre of much speculation regarding its memory bus. Initially, rumours pointed to a 512-bit memory bus, but subsequent rumours hinted at a 384-bit configuration. However, the latest leak from Panzerlied (via VideoCardz), the same source that revealed the Founder's Edition PCB design, suggests that the Blackwell GPU might feature a 448-bit bus, potentially utilising 14 out of the 16 available memory modules, in contrast to the previously anticipated 512-bit bus which was expected to use all 16.

If Nvidia indeed opts for the 448-bit memory interface, the Blackwell GPU could boast 28GB of GDDR7 memory, meaning it would offer a bandwidth of 1568GB/s (assuming a 28Gbps memory speed). Compared to its predecessor, that's a 50% increase.

While some may perceive the 28GB capacity as underwhelming compared to 32GB, it's worth noting that this configuration leaves room for potential future “Ti/SUPER” enhancements. Furthermore, the 512-bit memory bus might not be intended for gaming GPUs but could potentially find its application in the RTX Blackwell workstation series for high-memory usage workloads.

KitGuru says: With the RTX 4090 and the RTX 6000 Ada, Nvidia made a big mistake by creating two very similar-performing cards with a huge difference in price. With Blackwell, Nvidia looks to be trying to separate the two GPUs a little more, cutting down the memory bus on the GA202 for the RTX 5090 and saving the full die and bus for the RTX 6000 Blackwell.

The Zotac Zone has been teased over the last few days, but the company hasn't revealed the full technical specs for the upcoming handheld yet. The official reveal will be happening at Computex next week. However, a recent leak has revealed what we can expect ahead of time. 

The leak from VideoCardz claims the Zone handheld will be powered by an 8-core Ryzen 7 8840U CPU, featuring Radeon 780M integrated graphics with 12 RDNA3 CUs. The device will feature a 7-inch 120Hz AMOLED display with a 1080p resolution and 800 nits of maximum brightness. It will also include 16GB of LPDDR5X memory and support M.2 2280 SSDs with a default storage capacity of 512GB.

According to the leak, the Zone handheld's battery life might not be as good as other devices. It is expected to have a 48.5Wh battery with a runtime of 1.25 hours. The weight of the sample unit to be showcased at Computex has not been confirmed, but it is speculated to be under 700g.

Zotac has announced that the Zone handheld will be released in Q3 2024, but specific details about the release date and pricing have yet to be disclosed. However, Zotac claims that it expects to price it above the competition due to its premium features, like the AMOLED display.

KitGuru says: The AMOLED display will no doubt look nice. We'll be at Computex next week, so stay tuned for our extensive coverage. 

The DirectSR API has been integrated into the Agility Software Development Kit 1.714.0-preview, allowing developers to integrate various Super Resolution technologies into their games more easily. By consolidating technologies such as FSR, DLSS, and XeSS, DirectSR provides developers with a streamlined solution for implementation.

GPU hardware providers have been at the forefront of developing Super Resolution (SR) technology (XeSS, FSR, DLSS). As the number of SR variations continues to expand, it's becoming increasingly harder and more time-consuming for game developers to implement each SR technology. To solve this, Microsoft came up with a unified SR API that can seamlessly integrate SR technologies across different hardware platforms. This technology is called DirectSR.

We are excited to announce DirectSR is available now via Agility SDK 1.714.0-preview! This API was designed in partnership with AMD, Intel, and NVIDIA to enable the seamless integration of Super Resolution into the next generation of games. Check it out: https://t.co/L2RXOKcmjx

— DirectX 12 (@DirectX12) May 29, 2024

DirectSR is an API within the Agility SDK that aims to standardise SR support in D3D12 titles. Developed in collaboration with AMD, Intel, and Nvidia, this API enables the effortless utilisation of in-market upscaling technologies, supporting multi-vendor SR through a standard set of inputs and outputs. Currently, DirectSR offers built-in support for AMD FSR 2.2 and driver-level support for Intel XeSS and Nvidia DLSS.

DirectSR is natively supported in GPU drivers, and manufacturers can customise their SR implementation for optimal hardware performance. The API also includes built-in support for GPU-agnostic variations at the application level, ensuring usability across diverse hardware platforms. Furthermore, the API empowers users to select from multiple upscalers at runtime based on their hardware.

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KitGuru says: The inclusion of DirectSR offers a more simplified approach to upscaling, as well as simpler creation and, most likely, maintenance across several games. We look forward to seeing which games will have DirectSR support and how well they work across various hardware platforms.

AOC has recently unveiled its latest gaming monitor, the AOC Gaming 27G2ZN3/BK, featuring a 27-inch Fast VA panel. For less than £200, you'll get a fast gaming display, offering 1080p resolution at up to 280Hz. 

Notably, the monitor's standout feature is its 280Hz refresh rate. It supports a native 1080p resolution with a 1ms GtG response time, 0.5ms MPRT and Adaptive-Sync technology to reduce visual tearing. AOC claims the Fast VA panel has a contrast ratio of 4000:1, 300 nits of brightness, and can cover 92.2% of the DCI-P3 colour gamut and 123.3% of the sRGB colour space.

Moreover, the 27G2ZN3/BK offers versatility with a 100x100mm VESA mount, allowing users to wall-mount the monitor or use a third-party stand. Still, the included stand is already quite decent, providing pivot (0° to 90°±2°), swivel (-30°±2° ~ 30°±2°), and tilt (-4°±1° to 21.5°±1.5°) adjustments, as well as a height adjustment of up to 130mm.

In addition to its flat display, the AOC Gaming 27G2ZN3/BK has a matte coating to minimise glare. It also has a 3.5mm audio connector, a DisplayPort 1.4, and two HDMI 2.0 connections. Priced at £189.99 in the UK and €239 in the Eurozone, the monitor comes with a three-year guarantee in both regions.

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KitGuru says: For £189.99, this is most likely the cheapest 27-inch monitor with a 280Hz refresh rate you can get.

Hyte has just unveiled its latest PC cooling products, the highlight of which is its first 360mm AIO CPU cooler, the Thicc Q80 Trio. Alongside it, Hyte has introduced the Thicc P60 Duo, a more affordable 240mm AIO liquid cooler, and a new line of Thicc FP12 fans.

The Thicc Q80 Trio packs a 360mm long, 52mm thick radiator designed to absorb more heat than the average AIO liquid cooler. Equipped with Dual Harmonic Pumps, this cooler ensures efficient cooling for even the most powerful CPUs. Hyte's second-generation copper cold plate, with 50% more skived fin coverage and an enhanced liquid flow route, promises a reduction in temperatures by up to 2°C. The included Thicc FP12 Trio fans feature a new omnidirectional design promising an exceptional performance-to-noise ratio.

The Thicc Q80 Trio also features a 5″ IPS display with a 42-pixel qRGB array mounted above the cold plate on a double-hinged floating spout. The Thicc Q80 can also serve as a Nexus Link Primary Node, allowing it to connect up to 18 devices on a single channel and 36 devices over both available channels. Available in both black and white, the Thicc Q80 offers complete customisation via the Hyte Nexus software.

Meanwhile, the Thicc P60 Duo, Hyte's second 240mm AIO liquid cooler, presents a similar performance as the Q60 Duo but features a sleek new design at a more accessible price point. Like the Q80, it uses the same FP12 Duo fans, merging them into a single frame. Projector lenses catch dispersed rays of qRGB light and concentrate them into a beam to illuminate your system. With Nexus Link, the THICC P60 Duo can manage an entire system's cooling and lighting from a single connection, with up to 18 devices on a single port or up to 36 devices over both Type-C and Type-M channels. The P60 Dupo will be available in white and black.

Notably, the Thicc FP12 Duo and Trio fan sets used on the P/Q60 and Q80 AIOs can be acquired separately. A more seamless design incorporates all fans into a single frame, reducing cable clutter. The fibreglass-reinforced LCP blades can push up to 105.8 CFM airflow at a whopping 8.14 mmH2O static pressure. The included thermal and location sensors allow for intelligent system-wide cooling management with dynamic sensor input/output mapping and curves for each fan connected to the Hyte Nexus software. The fans also support Nexus Link, allowing users to connect them easily using a Type-M connector. These fan sets will be available in black and white.

The Thicc Q80 Trio and the Thicc FP12 Duo and Trio are slated for release in August 2024, while the Thicc P60 Duo is expected to hit the market in September 2024.

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KitGuru says: Interested in any of Hyte's new cooling products?

Zalman has unveiled the P50 DS, a new mid-tower case designed to support motherboards with reverse-side connections from the Asus BTF and MSI Project Zero ecosystems. This case is available in two colours (black and white) and features a pillarless design (front-left corner), offering a panoramic view of your build.

The Zalman P50 DS (black and white) has a small programmable display that connects to a USB 2.0 port, allowing the bundled software to provide real-time temperature and fan-speed monitoring via ACPI. The top compartment, featuring the motherboard tray (ATX, mATX and Mini-ITX support), can accommodate graphics cards up to 435mm long and CPU coolers up to 178mm tall.

In terms of ventilation, the case features three side-facing vents, a 140mm rear exhaust, and three 120mm top exhausts. The case comes bundled with four 120mm ARGB-illuminated fans. Radiator support is also pretty decent, allowing up to a 280/360mm radiator on top, up to a 360mm radiator on the side, and a 140mm radiator on the rear.

There are 2x 3.5/2.5-inch combo trays and 2x 2.5-inch mounts for drives. The bottom compartment allows you to install up to 225mm long PSUs and an extra 2.5/3.5-inch drive. On the front panel, users will find a USB-C 3.0 port, two USB-A 3.2 ports, and an HD Audio jack.

Discuss on our Facebook page, HERE.

KitGuru says: Since the launch of the original O11 Dynamic, pillarless cases have become increasingly common. Most manufacturers have at least one case with this design, but what would make you choose one instead of the other? In the P50 DS's case, the small monitoring display could be the unique selling point.

A recent report originating from Chiphell claims that AMD is working on four distinct desktop Zen 5 CPU models with different core configurations. Moreover, the same report also refers to the release date of these four CPUs, pointing to a launch in July.

According to wjm47196 (via VideoCardz), the initial line-up will feature Zen 5 architecture (no differentiation between standard and dense cores). The leak suggests AMD will release 16-core, 12-core, 8-core, and 6-core models, aligning with what we currently have from the Ryzen 7000 series.

It's rumoured that AMD is gearing up to unveil this new CPU line-up at Computex next week, with a planned launch by the end of July for desktop variants and August for mobile versions. Additionally, industry sources hint at the possibility of AMD introducing the Ryzen 9000 series, bypassing the Ryzen 8000 series and transitioning to next-generation AM5 CPUs. Moreover, rumours indicate that AMD might skip the 700-series chipsets and jump directly to the 800 series.

Although the leak does not explicitly mention any 3D V-Cache SKUs, the accelerated release of the Ryzen 9000 series suggests that the X3D models could arrive sooner than anticipated, possibly following Intel's debut of its Core Ultra 200 processors (Arrow Lake-S). That's assuming AMD will keep its release cadence of a six-month gap between the original Ryzen 7000 series and their updated X3D counterparts.

Discuss on our Facebook page, HERE.

KitGuru asks: Are you planning on getting a Zen 5 CPU as soon as it's available, or would you rather wait for X3D variants?

Cherry Xtrfy is set to launch the Ngale microphone line for gamers, broadcasters, and content creators. The Ngale X and Ngale R are the first microphones to be introduced under the Cherry Xtrfy brand, marking the company's expansion in the peripheral market.

The Ngale R stands out not only for its design but also for its feature set. This USB microphone prioritises sound quality with a sizeable cardioid capsule, making it ideal for streaming, voiceovers, and solo recordings. Gamers will appreciate the built-in low-cut filter to reduce background noise. The plug-and-play feature allows for an easy setup by simply connecting the microphone to the PC. Additionally, the Ngale R features RGB lighting with various colours and effects. A simple tap on the top of the microphone activates the mute function, indicated by the RGB illumination.

On the other hand, the Ngale X represents the premium model in the lineup, offering both XLR and USB capabilities in a dynamic microphone designed for professional use. Similar to the Ngale R, the Ngale X includes a low-cut filter to minimise background noise during gaming and RGB illumination that turns red when the microphone is muted. Users can connect the microphone to mixers or other professional audio equipment via XLR or directly to a computer via USB.

Alongside the microphones, Cherry introduced the Ngale Boom Arm, an adaptable microphone arm featuring convenient cable management and a 360-degree rotating mechanism. Compatible with the Ngale R, Ngale X, and other microphones using standard threading, the Ngale Boom Arm is designed for easy installation and adjustment without additional tools. The Ngale R, Ngale X, and Ngale Boom Arm are now available, with the Ngale R priced at $119.99, the Ngale X at $179.99, and the Ngale Boom Arm at $99.99.

Discuss on our Facebook page, HERE.

KitGuru says: Which of the two new Cherry Xtrfy mics would you prefer? Would you add the boom arm, or would the standard feet be good enough for you?

Thermalright has recently unveiled the Burst Assassin 120 Evo Dark, a single-tower CPU cooler featuring a dual-fan configuration. This cooler promises to deliver efficient cooling performance without encroaching on valuable space or interfering with memory slots.

The cooler has a slim, blacked-out heatsink to minimise potential conflicts with adjacent memory modules. With six 6mm heat pipes, the Burst Assassin 120 Evo Dark significantly enhances heat dissipation. Two 120mm TL-C12B V2 fans with Sealed Fluid Dynamic bearings (S-FDB) cool the heatsink.

Operating at a maximum speed of 1500 RPM (with a +/- 10% variance), these fans can push up to 66.17 CFM of air with a static pressure of up to 1.53mmH2O. The noise level remains at a moderate 25.6dBA, striking a commendable balance between efficiency and acoustics. Furthermore, including 4-pin PWM connections allows for dynamic speed control based on thermals.

In terms of compatibility, this CPU cooler supports a wide range of CPU socket types, including Intel's LGA 1700, LGA 1200, and LGA 115x, as well as AMD's AM5 and AM4. The compact dimensions of 124x52x156 mm (WxDxH) make it an attractive choice for systems with spatial constraints. Pricing hasn't been revealed yet, but seeing the non-Evo Dark model cost less than £20, this one should be that far off.

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KitGuru says: Considering the Burst Assassin 120 Evo Dark is pretty much the same as the original Burst Assassin with an additional fan, we expect it to offer slightly better cooling performance.

Lenovo is gearing up to unveil a “Lite” version of the Legion Go. In contrast to the ROG Ally X, which is expected to be more powerful and more expensive, the upcoming Legion Go Lite should offer a more budget-friendly option, possibly featuring a less powerful AMD CPU.

The Legion Go and the Ally are equipped with AMD Ryzen Z1 Extreme APUs, featuring up to 8 Zen 4 cores and 12 RDNA 3 compute units. However, the Legion Go isn't available with the more affordable Ryzen Z1 APU (unlike the Ally), which packs 6x Zen 4 cores and 4x RDNA 3 CUs.

According to Windows Central, Lenovo may be considering integrating such an APU in a new Lite model. Although details regarding the Lite version have not been confirmed, rumours point towards a smaller screen and the absence of the original's detachable controllers, as Nintendo did with the Switch Lite. 

With the Legion Go going for around £700 (occasionally cheaper), the Lite edition should hit the market at a lower price tag.

Discuss on our Facebook page, HERE.

KitGuru says: Although a cheaper version of the Legion Go would most likely help Lenovo grow in the gaming handheld market, the company has a lot of room to improve on the software side of things. For example, the ROG Ally already supports Fluid Motion Frames, but the Legion Go doesn't. Fortunately, some people have already developed third-party solutions to enable AFMF but we hope to see official support eventually.

An Aoostar representative might have revealed the release month for the AMD Strix Point CPUs. When asked about the release of its next-gen Ryzen PC, the company's employee answered that it was estimated to be released in October, but bigger OEMs would get them sooner, pointing to August.

As noted by VideoCardz, the Aoostar representative wasn't clear regarding what next-gen Ryzen CPU they were referring to. However, considering the company has yet to launch a mini-PC based on a desktop CPU, we think it's safe to assume it was the Strix Point series (aka Ryzen AI 100/300).

The upcoming Strix Point processors are expected to debut in the second half of this year, promising enhanced performance and efficiency. Powered by AMD Zen 5 CPU cores and (presumably) an RDNA 3.5 iGPU, these APUs are expected to feature up to 12 CPU cores (4x Zen 5 + 8x Zen 5c) with 24 threads, 16x Compute Units and an XDNA 2 NPU.

Computex kicks off next week, so we may learn more official details straight from AMD very soon.

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KitGuru says: Are you planning on getting a new laptop soon? If so, it might be worth waiting for the AMD Strix Point APUs to arrive.

AMD might launch a new Radeon laptop GPU, the RX 7650M XT. The rumour originates from Aoostar's Discord server, where a Chinese PC manufacturer representative said the company would launch a new external GPU based on the unannounced Radeon mobile GPU.

As reported by VideoCardz, Aoostar also hinted at revealing additional models besides the one using a 7650M XT GPU. These will all be based on other Radeon GPUs, but it's unclear if they'll be based on laptop GPUs, desktop GPUs, or both.

With the RX 7650M XT's nomenclature indicating a minor specification bump rather than a new GPU, the upcoming model will likely be based on the Navi 33 GPU.

There were rumours that Navi 32 would find its way to laptops, but that hasn't happened yet. However, with Computex right around the corner, that might change soon.

Discuss on our Facebook page, HERE.

KitGuru says: Would you like to see a wider range of RDNA 3 GPUs available for laptops?

New rumours about Nvidia's upcoming AI processor specifications have come to our attention. It has been claimed that the AI SoC will use ARM cores, a Blackwell GPU, and LPDDR6 memory. However, conflicting information about the process node leaves us wondering if TSMC or Intel will manufacture it.

ARM is reportedly preparing to launch a new high-performance core codenamed “Blackhawk” for next-generation flagship smartphones by the end of the year. This next-generation Cortex is expected to be named Cortex-X5 and is anticipated to play a significant role in Nvidia's upcoming AI processor, according to AGF.

During the same interview, Dell leaked it: Nvidia is coming next year in the Windows ARM arena with new SoCs to compete with Qualcomm.
What I can say: TSMC N3P, Cortex X5 BlackHawk CPU cluster, Blackwell GPU and LPDDR6 on package. And MS is porting all Win11 AI stuff to NV HW https://t.co/dSGv44A1G0

— AGF (@XpeaGPU) May 23, 2024

AGF also claimed that Nvidia's upcoming SoC will use ARM Cortex-X5 “Blackhawk” CPU cores, Blackwell integrated graphics, and LPDDR6 memory. The SoC will supposedly based on TSMC's N3P node, but conflicting claims from Kepler_L2 suggest that the green team might use Intel's 3nm node instead.

Rumours regarding Nvidia's potential venture into the mobile market with ARM-based processors have been circulating for months, with rumours claiming these chips would target the next-generation Nintendo Switch and other gaming handhelds to CPUs designed for AI PCs meeting Microsoft Copilot+ specifications and rival the Snapdragon X SoCs. More recently, we've heard that these processors are being made in collaboration with Mediatek. Hopefully, we'll learn more about them in Computex.

Discuss on our Facebook page, HERE.

KitGuru says: Whether it's based on TSMC N3P or Intel 3nm process node, Nvidia's AI processor is shaping up to be a very interesting launch. 

There have been a few Xbox Series X/S and PS5 titles that support AMD's FSR 2 upscaling to improve performance. Now, console gamers can utilise the latest version, FSR 3, complete with Frame Generation technology for a frame rate boost.

Immortals of Aveum was one of the first PC games to integrate AMD FidelityFX Super Resolution 3 (FSR 3). The game was released in August only with FSR 2 and DLSS Frame Generation, but it didn't take long for the developer to add support for the latest iteration of AMD's upscaling and frame generation technologies.

The full patch notes for Immortals of Aveum May 24 update can be found below:

• HDR on all platforms
• AMD FSR 3 with Frame Generation on all platforms
• FSR 3 support for VRR displays on all platforms
• Improvements to FSR 3 on PC
• New endgame objectives and boss battle in “The Echollector” gameplay update
• New Game +
• Tougher challenges in the new “Grand Magnus” difficulty mode
• Key fixes to DLSS
• Improvements to mouse settings, such as mouse sensitivity
• Console brightness adjustments and added a Gamma Correction slider
• Tons of other performance improvements, bug fixes, and game enhancements

The introduction of frame generation on consoles is made possible due to the Xbox Series X/S and PS5 utilising AMD's RDNA architecture for graphics. It is unclear if many other games will update with FSR 3 and Frame Gen on consoles, but we'll be keeping an eye out. Currently, Immortals of Aveum is available to play through Xbox Game Pass (PC and Console) and it is also part of the PlayStation Plus library. 

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KitGuru says: What other games would you like to see supporting FSR 3 Frame Generation?

G.Skill's ‘Royal' series memory offered striking aesthetics and high-speeds during the DDR4 generation. We've yet to see new Trident Royal DDR5 memory, but that is changing soon. G.Skill has now unveiled Trident Z5 Royal memory kits for the first time, bringing the striking, jewel-encrusted design to a new generation. 

Trident Z5 Royal brings the popular luxury design to the new generation of DDR5 memory under the Trident Z5 name. Each heat spreader is CNC-cut from aluminium and electroplated, resulting in the extravagant look we're used to from the G.Skill Royal memory series.

Initially, the Trident Z5 Royal will be available in kits with speeds of up to DDR5-8400 (CL40) in 48GB (2x 24GB) capacity. Up to 96GB (2x 48GB) will also be available, running at lower speeds. Moreover, the G.Skill Trident Z Lighting Control app and third-party motherboard lighting software enable customisable RGB lighting.

The new Trident Z5 Royal series DDR5 memory kits, which support the newest Intel XMP 3.0 memory overclocking profiles via the motherboard BIOS, will be available in late May 2024.

Discuss on our Facebook page, HERE.

KitGuru says: Have you ever owned a G.Skill Royal memory kit? Are you planning on getting a new one now that it's available with DDR5 memory?

Following the old AMD naming logic, the upcoming AMD Strix Point APUs were thought to be launching as the ‘Ryzen 8000' series. However, new reports claim that these upcoming chips will actually launch under AMD's new ‘Ryzen AI' branding instead. 

Contrary to what we thought up to now, it seems the next generation of Ryzen laptop APUs will be named Ryzen AI 300. This information is sourced from Golden Pig Upgrade and a Lenovo product manager, posting on the Chinese sites, Weibo and Bilibili. (via VideoCardz). The nomenclature change is apparently a move by AMD to have a “higher-numbered” series than Intel's, which will soon launch the Core Ultra 200 series. 

This mobile architecture has Zen 5 cores and an improved RDNA 3.5 graphics architecture. One of the Ryzen Strix Point APUs listed by Asus was the 12-core Ryzen AI 9 HX 170, which has since apparently been renamed Ryzen AI 9 HX 370. As far as we know, this is the highest-end APU of the series. Rumours say that there will also be a Ryzen AI 9 365 SKU with ten cores.

With Computex right around the corner, we expect to learn more about AMD's plans for new hardware quite soon. 

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KitGuru says: Do you think we'll see Ryzen AI branding spreading to desktop processors in the near future? 

InWin has introduced the ModFree Mini, the latest addition to the ModFree ecosystem. More than a mere add-on component, the ModFree Mini offers users the flexibility to build a standalone SFF PC or integrate it with a full ATX ModFree system for a multi-system solution.

With the Mod-II and the Mod-III, you can personalise your rig with a choice of panels, including Monarch, Mesh, and Timber. Despite its small size, the ModFree Mini doesn't compromise on ventilation. With visually appealing panel designs featuring vented patterns across all three variants, the system ensures ample ventilation and cooling performance.

The Mod-III frame accommodates a Mini-ITX motherboard, a full-size ATX12V PSU (up to 170mm long), and a 2.5″ SSD. Users can stack additional Mod-II or Mod-III modules on top to house a GPU (up to 3.5 slots, 320mm maximum length), a liquid cooling radiator (up to 240/280mm), or additional storage drives (up to 3x 3.5-inch or 4x 2.5-inch). To connect the modules, simply disassemble the included foot stand and connect the modules.

To learn how to use and mount the new ModFree Mini cases, InWin recommends using the mobile app (available for Android and iOS). The app features an interactive 3D assembly guide, which helps you visualise the mounting process better.

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KitGuru says: Modular case kits have been interesting to follow in recent years. What do you think of the new InWin Mod Free Mini kit? Would you use one of these for a small and slim PC build?